Electronics package with integrated lugs for cooling attachment
A board mounted integrated electronics package assembly is provided with one or more securing elements to attach a heat dissipating device directly to the package. The securing element(s) is located along a periphery of the package and anchors a base of the heat dissipating device to the package, th...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | A board mounted integrated electronics package assembly is provided with one or more securing elements to attach a heat dissipating device directly to the package. The securing element(s) is located along a periphery of the package and anchors a base of the heat dissipating device to the package, thereby eliminating employment of a secondary heat dissipating material between the package and the heat dissipating device. |
|---|