Method of correcting a mask pattern and method of manufacturing a semiconductor device

The method of manufacturing a semiconductor device has deciding an amount of a correction of a mask pattern for a size of an active region of a semiconductor substrate, correcting the mask pattern on the basis of the decided amount of the correction, and exposing a resist film by using an exposure m...

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Bibliographische Detailangaben
1. Verfasser: Masanori, Terahara
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The method of manufacturing a semiconductor device has deciding an amount of a correction of a mask pattern for a size of an active region of a semiconductor substrate, correcting the mask pattern on the basis of the decided amount of the correction, and exposing a resist film by using an exposure mask having the corrected mask pattern.