Circuit pattern formation device and method of forming circuit pattern to substrate

An object is to improve the adhesion strength between a circuit pattern and its substrate without increasing the resistance value of the circuit pattern in preparation of a circuit pattern holding substrate. A circuit pattern formation device forms, after forming a precursor circuit-pattern in the surface of a dielectric thin film body , a circuit pattern onto a target substrate from the dielectric thin film body. After forming an electrostatic latent image in the upper surface of the dielectric thin film body, the electrostatic latent image is exposed using an exposure unit to prepare a pattern. A development apparatus supplies a conductive particle dispersion solution to this pattern to form a precursor circuit-pattern. By energizing the circuit pattern holding substrate , in which an adhesive layer is formed, the precursor circuit-pattern is temporarily transferred to the circuit pattern holding substrate. The transferred precursor circuit-pattern is heated using the heater to form a circuit pattern. The circuit pattern and the adhesive layer are released from the circuit pattern holding substrate, thereby transferring to the target substrate.