Fixing mechanism for fixing a removable module of an electronic device

A fixing mechanism includes a housing whereon an opening and a first hole are formed. A first fixing component is disposed on the housing. The fixing mechanism further includes a frame installed inside the housing through the opening for fixing a removable module. A first wedging component is disposed on the frame for wedging with the first fixing component so as to fix the removable module inside the housing. The fixing mechanism further includes a releasing component installed inside the first hole for pressing the first wedging component so as to separate the first wedging component from the first fixing component.