Controlled impedance structures for high density interconnections

An interconnection structure suitable for use as an IC package, probe head or other electrical termination of high density where uninterrupted controlled impedance is desired is described.

Bibliographische Detailangaben

Hauptverfasser:	Fjelstad, Joseph C, Grundy, Kevin P
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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