Controlled impedance structures for high density interconnections
An interconnection structure suitable for use as an IC package, probe head or other electrical termination of high density where uninterrupted controlled impedance is desired is described.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | An interconnection structure suitable for use as an IC package, probe head or other electrical termination of high density where uninterrupted controlled impedance is desired is described. |
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