Multilayer adhesive for thermal reversible joining of substrates
One embodiment of the invention includes a multilayer dry adhesive system capable of reversible joining of rigid substrates.
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| Format: | Patent |
| Sprache: | eng |
| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | One embodiment of the invention includes a multilayer dry adhesive system capable of reversible joining of rigid substrates. |
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