Substrate structure

It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure of the first embodiment is provided with a substrate , a plurality of electronic components mounted along the substrate , and a resin part that covers the electronic components and is in close contact with the substrate . In the substrate structure , the resin part is provided with a reinforcing heat discharge layer covering the electronic components and having a heat conductivity and a reinforcing property and a shield layer covering the reinforcing heat discharge layer , and a surface o of the shield layer is formed into a predetermined shape corresponding to a surface structure of the display device adjacent to the resin part