Amide-substituted silicones and methods for their preparation and use
A composition includes: (A) an amide-substituted silicone and (B) a thermally conductive filler. The composition may be used as a thermal interface material for dissipating heat from electronic devices.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A composition includes: (A) an amide-substituted silicone and (B) a thermally conductive filler. The composition may be used as a thermal interface material for dissipating heat from electronic devices. |
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