Ultrasonic bonding of dissimilar materials
Ultrasonically bonded laminated absorbent products comprising a first substrate, a second substrate, and an adhesive composition are disclosed. The first and second substrates are dissimilar or non-bondable materials. The adhesive composition comprises a mixture of atactic and isotactic polymers suc...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | Ultrasonically bonded laminated absorbent products comprising a first substrate, a second substrate, and an adhesive composition are disclosed. The first and second substrates are dissimilar or non-bondable materials. The adhesive composition comprises a mixture of atactic and isotactic polymers such that it has melt and flow characteristics similar to those of the materials. |
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