Method and apparatus for dynamic measurement of across-chip temperatures

In one embodiment, the invention is a method and apparatus for dynamic measurement of across-chip temperatures. One embodiment of a method for measuring temperatures across an integrated circuit chip includes generating a plurality of surface images of the integrated circuit chip, deriving power val...

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1. Verfasser:	Bernstein, Kerry
Format:	Patent
Sprache:	eng
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creator	Bernstein, Kerry
description	In one embodiment, the invention is a method and apparatus for dynamic measurement of across-chip temperatures. One embodiment of a method for measuring temperatures across an integrated circuit chip includes generating a plurality of surface images of the integrated circuit chip, deriving power values across the integrated circuit chip from the surface images, computing the temperatures across the integrated circuit chip in accordance with the power values, and outputting the temperatures.
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fullrecord	<record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07946760</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07946760</sourcerecordid><originalsourceid>FETCH-uspatents_grants_079467603</originalsourceid><addsrcrecordid>eNrjZPDwTS3JyE9RSMwD4oKCxKLEktJihbT8IoWUyrzE3MxkhdzUxOLSotTc1LwShfw0hcTkovziYt3kjMwChZLU3IJUkI6i1GIeBta0xJziVF4ozc2g4OYa4uyhW1pckFgC1Fwcn16UCKIMzC1NzMzNDIyJUAIAkOA1tA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method and apparatus for dynamic measurement of across-chip temperatures</title><source>USPTO Issued Patents</source><creator>Bernstein, Kerry</creator><creatorcontrib>Bernstein, Kerry ; International Business Machines Corporation</creatorcontrib><description>In one embodiment, the invention is a method and apparatus for dynamic measurement of across-chip temperatures. One embodiment of a method for measuring temperatures across an integrated circuit chip includes generating a plurality of surface images of the integrated circuit chip, deriving power values across the integrated circuit chip from the surface images, computing the temperatures across the integrated circuit chip in accordance with the power values, and outputting the temperatures.</description><language>eng</language><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7946760$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,802,885,64039</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7946760$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Bernstein, Kerry</creatorcontrib><creatorcontrib>International Business Machines Corporation</creatorcontrib><title>Method and apparatus for dynamic measurement of across-chip temperatures</title><description>In one embodiment, the invention is a method and apparatus for dynamic measurement of across-chip temperatures. One embodiment of a method for measuring temperatures across an integrated circuit chip includes generating a plurality of surface images of the integrated circuit chip, deriving power values across the integrated circuit chip from the surface images, computing the temperatures across the integrated circuit chip in accordance with the power values, and outputting the temperatures.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZPDwTS3JyE9RSMwD4oKCxKLEktJihbT8IoWUyrzE3MxkhdzUxOLSotTc1LwShfw0hcTkovziYt3kjMwChZLU3IJUkI6i1GIeBta0xJziVF4ozc2g4OYa4uyhW1pckFgC1Fwcn16UCKIMzC1NzMzNDIyJUAIAkOA1tA</recordid><startdate>20110524</startdate><enddate>20110524</enddate><creator>Bernstein, Kerry</creator><scope>EFH</scope></search><sort><creationdate>20110524</creationdate><title>Method and apparatus for dynamic measurement of across-chip temperatures</title><author>Bernstein, Kerry</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_079467603</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Bernstein, Kerry</creatorcontrib><creatorcontrib>International Business Machines Corporation</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Bernstein, Kerry</au><aucorp>International Business Machines Corporation</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method and apparatus for dynamic measurement of across-chip temperatures</title><date>2011-05-24</date><risdate>2011</risdate><abstract>In one embodiment, the invention is a method and apparatus for dynamic measurement of across-chip temperatures. One embodiment of a method for measuring temperatures across an integrated circuit chip includes generating a plurality of surface images of the integrated circuit chip, deriving power values across the integrated circuit chip from the surface images, computing the temperatures across the integrated circuit chip in accordance with the power values, and outputting the temperatures.</abstract><oa>free_for_read</oa></addata></record>
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title	Method and apparatus for dynamic measurement of across-chip temperatures
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-19T10%3A57%3A37IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Bernstein,%20Kerry&rft.aucorp=International%20Business%20Machines%20Corporation&rft.date=2011-05-24&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07946760%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true