Method and apparatus for dynamic measurement of across-chip temperatures

In one embodiment, the invention is a method and apparatus for dynamic measurement of across-chip temperatures. One embodiment of a method for measuring temperatures across an integrated circuit chip includes generating a plurality of surface images of the integrated circuit chip, deriving power val...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Bernstein, Kerry
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:In one embodiment, the invention is a method and apparatus for dynamic measurement of across-chip temperatures. One embodiment of a method for measuring temperatures across an integrated circuit chip includes generating a plurality of surface images of the integrated circuit chip, deriving power values across the integrated circuit chip from the surface images, computing the temperatures across the integrated circuit chip in accordance with the power values, and outputting the temperatures.