Multi-chip package

A semiconductor package is disclosed. Particularly, a multi-chip package is disclosed, which can stably maintain insulation between a plurality of semiconductor chips and effectively release heat to the outside. The semiconductor package includes an insulation layer including a diamond layer formed...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Eom, Joo-yang, Park, Min-hyo, Choi, Seung-yong
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A semiconductor package is disclosed. Particularly, a multi-chip package is disclosed, which can stably maintain insulation between a plurality of semiconductor chips and effectively release heat to the outside. The semiconductor package includes an insulation layer including a diamond layer formed by a chemical vapor deposition method between a lead frame or a heat sink and the semiconductor chips disposed thereon.