Integrated circuit package
An integrated circuit package is described that includes an integrated circuit die, a plurality of lower contact leads, and an insulating substrate positioned over the die and lower contact leads. The insulating substrate includes a plurality of electrically conducting upper routing traces formed on...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | An integrated circuit package is described that includes an integrated circuit die, a plurality of lower contact leads, and an insulating substrate positioned over the die and lower contact leads. The insulating substrate includes a plurality of electrically conducting upper routing traces formed on the bottom surface of the substrate. The traces on the bottom surface of the substrate electrically couple each lower contact lead with an associated I/O pad. |
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