Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating compo...

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Bibliographische Detailangaben
Hauptverfasser: Choi, Kyoung-sei, Kim, Byung-seo, Joo, Young-jae, Chung, Ye-chung, Cho, Kyong-soon, Lee, Sang-heui, Lee, Si-hoon, Kang, Sa-yoon, Son, Dae-woo, Jo, Sang-gui, Ha, Jeong-kyu, Cho, Young-sang
Format: Patent
Sprache:eng
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Zusammenfassung:Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.