Arrangement for surface mounting an electrical component by soldering, and electrical component for such an arrangement
An arrangement may include a substrate and an electrical component. The electrical component may include a base made of an insulating material and a plurality of connection terminals. Each connection terminal is connected to a corresponding connection pad of the substrate by means of a spot of solde...
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| Sprache: | eng |
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| Zusammenfassung: | An arrangement may include a substrate and an electrical component. The electrical component may include a base made of an insulating material and a plurality of connection terminals. Each connection terminal is connected to a corresponding connection pad of the substrate by means of a spot of solder paste. The arrangement may further include a block interposed between the substrate and the base of the electrical component. The block may be located substantially on the axis of application of a force for actuating the electrical component and may be designed to inhibit deformation of the base. The block may include a spot of solder paste soldered to an associated conducting pad on the substrate. |
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