Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making same

Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making same

An integrated circuit package employs a solder pad that includes a predetermined three dimensional surface that is adapted to receive solder. In one example, the predetermined three dimensional surface includes at least one predetermined hill or protruding portion and a valley portion, such as a low...

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Hauptverfasser: Zbrzezny, Adam R, Topacio, Roden R
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Topacio, Roden R
description An integrated circuit package employs a solder pad that includes a predetermined three dimensional surface that is adapted to receive solder. In one example, the predetermined three dimensional surface includes at least one predetermined hill or protruding portion and a valley portion, such as a lower portion, having a predetermined relative height between the hill portion and a valley portion. The predetermined three dimensional surface can be configured in any suitable configuration and may include contoured patterns, non-patterns, or any other suitable configuration as desired. A related method is also described.
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In one example, the predetermined three dimensional surface includes at least one predetermined hill or protruding portion and a valley portion, such as a lower portion, having a predetermined relative height between the hill portion and a valley portion. The predetermined three dimensional surface can be configured in any suitable configuration and may include contoured patterns, non-patterns, or any other suitable configuration as desired. A related method is also described.</abstract><oa>free_for_read</oa></addata></record>
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title Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making same
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