Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making same

An integrated circuit package employs a solder pad that includes a predetermined three dimensional surface that is adapted to receive solder. In one example, the predetermined three dimensional surface includes at least one predetermined hill or protruding portion and a valley portion, such as a lower portion, having a predetermined relative height between the hill portion and a valley portion. The predetermined three dimensional surface can be configured in any suitable configuration and may include contoured patterns, non-patterns, or any other suitable configuration as desired. A related method is also described.