Method for the production of a semiconductor component comprising a planar contact, and semiconductor component

In a method for producing a semiconductor component, in particular a semiconductor structure having a surface structure or topography which is produced by means of electronic components on a substrate, at least one electronic component is applied to a substrate, and an isolation layer is applied to the topography which is produced by means of the at least one component on the substrate. Contact-making openings are then produced in the isolation layer at contact points for the at least one electronic component, the isolation layer and the contact points in the contact-making openings are planar-metallized, and the metallization is structured in order to produce electrical connections, with the isolation layer having a glass coating.