Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers
A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect. |
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