Component shape profiling method and component mounting method

A method for profiling the shape of a component using a line sensor which is provided in a component mounter and which profiles the shape of the component three-dimensionally by (a) projecting a sweeping light onto the component in a relative movement between the line sensor and the component held b...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Hada, Junichi, Hachiya, Eiichi
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method for profiling the shape of a component using a line sensor which is provided in a component mounter and which profiles the shape of the component three-dimensionally by (a) projecting a sweeping light onto the component in a relative movement between the line sensor and the component held by a mounting head so that the sweeping light traverses the direction of the movement and (b) detecting the reflected light from the component using a detector. The method includes getting the component from the component supply unit using the mounting head, rotating the component by a predetermined angle within a predetermined surface, and profiling the shape of the rotated component using the line sensor.