Light emitting packages and methods of making same

In a light emitting package, at least one light emitting chip is supported by a board. A light transmissive encapsulant is disposed over the at least one light emitting chip and over a footprint area of the board. A light transmissive generally conformal shell is disposed over the encapsulant and has an inner surface spaced apart by an air gap (G) from, and generally conformal with, an outer surface of the encapsulant. At least one phosphor is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m·K).