Sealing board and method for producing the same
There is provided a sealing board for sealing a container containing an electronic component, constituted of a base which is made of a material exhibiting a low wettability to a brazing filler metal and on a surface of which a metal layer exhibiting a high wettability to the brazing filler metal is...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | There is provided a sealing board for sealing a container containing an electronic component, constituted of a base which is made of a material exhibiting a low wettability to a brazing filler metal and on a surface of which a metal layer exhibiting a high wettability to the brazing filler metal is formed, a brazing filler metal portion formed on the metal layer to form a closed region, and an exposed portion in which a surface of the base is exposed in at least a part of the closed region. By making at least a part of the sealing board as the exposed portion, it is possible to produce the sealing board with the brazing filler metal for a package stable in quality and inexpensively. |
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