Method and system for randomizing wafers in a complex process line

By coordinating a process regime of a process module for sample substrates used in a previously performed metrology process, an increased degree of measurement information may be obtained. For this purpose, the coordination may be based on a sampling ruleset related to the process module, wherein the previously selected sample substrates may be appropriately sequenced through the process module to increase the probability for complying with the associated sampling ruleset. Furthermore, the enhanced process coordination may be advantageously combined with randomization steps, thereby providing a "pseudo randomization," in which sample substrates are intentionally positioned, while the remaining substrates may be randomized for decoupling related process steps.