Embossing method and apparatus

A method and apparatus for forming a patterned layer having a surface profile that provides relief structures within an electronic device. The method comprises the steps of taking a carrier film having an inverse of the required surface profile formed on one side thereof, taking a layer of fixable material located on a substrate, laminating the carrier film and substrate such the carrier film causes the required surface profile to be formed in the layer of fixable material with a predetermined offset, and then fixing the fixable material. Lamination may be performed using rollers or a vacuum process. The process is designed to ensure that the offset can be kept as low as possible, preferably to within 150 nm.