Flexible encapsulant materials for micro-fluid ejection heads and methods relating thereto

Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; fr...

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Bibliographische Detailangaben

Hauptverfasser:	Graham, David Christopher, Hall, Eric Spencer, Holt, Jr, Gary Anthony, Hubert, II, Richard Leo, Massie, Johnny Dale, Weaver, Sean Terrance, Laurer, Jonathan Harold, Wells, Rich
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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