Flexible encapsulant materials for micro-fluid ejection heads and methods relating thereto
Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; fr...
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Sprache: | eng |
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Zusammenfassung: | Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; from about 0.1 to about 20.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 50.0 percent by weight filler, and exhibits a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.). |
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