Method and apparatus for improving force control in wafer scribing
When scribing a substrate, the precise location of the outer peripheral edge of the substrate on a stage is determined and movement of a scribe tool is controlled to first bring the scribe tool into engagement with the substrate at a location inwardly of the outer peripheral edge of the substrate. A...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | When scribing a substrate, the precise location of the outer peripheral edge of the substrate on a stage is determined and movement of a scribe tool is controlled to first bring the scribe tool into engagement with the substrate at a location inwardly of the outer peripheral edge of the substrate. After a downwardly directed force of predetermined magnitude exerted by the scribe tool has been attained and stabilized, the scribe tool is moved along the substrate to form a scribe line. |
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