Chemical mechanical polishing pad having secondary polishing medium capacity control grooves
A chemical mechanical polishing pad that includes a polishing layer having a set of primary grooves formed in a polishing surface of the pad. The pad also includes a set of secondary grooves that become selectively active as a function of the wear of the polishing layer from polishing.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A chemical mechanical polishing pad that includes a polishing layer having a set of primary grooves formed in a polishing surface of the pad. The pad also includes a set of secondary grooves that become selectively active as a function of the wear of the polishing layer from polishing. |
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