Printed circuit board
A circuit board has a top face for positioning an electronic component and a bottom face used as a support on a heat-dissipating base. A plurality of heat transfer holes provide heat transfer from the top face to the bottom face. The heat transfer holes are unevenly or non-uniformly distributed on t...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A circuit board has a top face for positioning an electronic component and a bottom face used as a support on a heat-dissipating base. A plurality of heat transfer holes provide heat transfer from the top face to the bottom face. The heat transfer holes are unevenly or non-uniformly distributed on the top face in such a way that the top face is provided with several free sectors which are free of heat transfer holes in order to connect the electronic component to the circuit board. The free sectors are configured as columns or lines. A plurality of heat transfer holes are placed at least along the long sides of the free sectors. The circuit board has a low thermal resistance between the electronic component and the heat-dissipating base. |
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