Coating process apparatus and coating film forming method

aabaThe resist coating unit (COT) has a spin chuck which holds the wafer to be supplied with a resist liquid, and a process cup which accommodates the spin chuck and exhaustes an atmosphere around the wafer W from a bottom thereof. The process cup comprises a first cup with an outer circumferential wall, and an airflow control member laid out close to the wafer W in the first cup in such a manner as to surround the wafer W. The airflow control member has a vertical cross section of an approximately rectangular shape defined by the upper ring portion having a cross section of an approximately triangular shape and protruding upward, and a lower ring portion having a cross section of an approximately triangular shape and protruding downward. An exhaust passage for substantially exhausting the atmosphere around the wafer W is formed between the outer circumferential wall and the airflow control member.