Rolled copper foil and manufacturing method thereof

Cu A rolled copper foil applied with a recrystallization annealing after a final cold rolling step and having a crystal grain alignment satisfying a ratio of [a]/[b]≧3, where [a] and [b] are normalized average intensities of a {111}plane diffraction of a copper crystal by β-scanning at α=35° and 74°...

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Bibliographische Detailangaben
Hauptverfasser: Muroga, Takemi, Ito, Yasuyuki, Aoyagi, Koji, Yamamoto, Yoshiki, Yokomizo, Kenji, Nomura, Katsumi
Format: Patent
Sprache:eng
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Zusammenfassung:Cu A rolled copper foil applied with a recrystallization annealing after a final cold rolling step and having a crystal grain alignment satisfying a ratio of [a]/[b]≧3, where [a] and [b] are normalized average intensities of a {111}plane diffraction of a copper crystal by β-scanning at α=35° and 74°, respectively, in an X-ray diffraction pole figure measurement to a rolled surface is manufactured by controlling a total working ratio in the final cold rolling step before the recrystallization annealing to be 94% or more; and controlling a working ratio per one pass in the final cold rolling step to be 15 to 50%.