Semiconductor device with different conductive features embedded in a mold enclosing a semiconductor die and method for making same
A method for making a semiconductor device includes creating conductive structures on a substrate. Contact pads of a semiconductor die are connected to first ends of conductive structures. The semiconductor die is encapsulated or embedded and the substrate is removed such that second ends of the con...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | A method for making a semiconductor device includes creating conductive structures on a substrate. Contact pads of a semiconductor die are connected to first ends of conductive structures. The semiconductor die is encapsulated or embedded and the substrate is removed such that second ends of the conductive structures are exposed to the exterior. |
|---|