Power module

A power semiconductor module comprises a housing. The housing comprises a casing and at least one coating of high resistance to surface tracking. A plurality of electrical conductors is provided on the housing. The coating is provided on a creepage distance that is provided between the electrical co...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Tschirbs, Roman, Spanke, Reinhold
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A power semiconductor module comprises a housing. The housing comprises a casing and at least one coating of high resistance to surface tracking. A plurality of electrical conductors is provided on the housing. The coating is provided on a creepage distance that is provided between the electrical conductors.