Transducer assembly for a bonding apparatus
A transducer assembly for a bonding apparatus is provided that comprises a horn having first and second base ends and a bonding tool attached to the horn between the first and second base ends. First and second ultrasonic generators are secured to the first and second base ends respectively. A first...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A transducer assembly for a bonding apparatus is provided that comprises a horn having first and second base ends and a bonding tool attached to the horn between the first and second base ends. First and second ultrasonic generators are secured to the first and second base ends respectively. A first fastening mechanism is located on the horn between the bonding tool and the first ultrasonic generator and a second fastening mechanism is located on the horn between the bonding tool and the second ultrasonic generator such that the horn is releasably attachable to a mounting interface using the first and second fastening mechanisms. There are also transducer mounting positions disposed on the mounting interface for mounting the mounting interface to a bond head. |
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