Latch-up resistant semiconductor structures on hybrid substrates and methods for forming such semiconductor structures

Latch-up resistant semiconductor structures formed on a hybrid substrate and methods of forming such latch-up resistant semiconductor structures. The hybrid substrate is characterized by first and second semiconductor regions that are formed on a bulk semiconductor region. The second semiconductor r...

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Bibliographische Detailangaben
Hauptverfasser: Mandelman, Jack Allan, Tonti, William Robert
Format: Patent
Sprache:eng
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Zusammenfassung:Latch-up resistant semiconductor structures formed on a hybrid substrate and methods of forming such latch-up resistant semiconductor structures. The hybrid substrate is characterized by first and second semiconductor regions that are formed on a bulk semiconductor region. The second semiconductor region is separated from the bulk semiconductor region by an insulating layer. The first semiconductor region is separated from the bulk semiconductor region by a conductive region of an opposite conductivity type from the bulk semiconductor region. The buried conductive region thereby the susceptibility of devices built using the first semiconductor region to latch-up.