Integrated circuit package having integrated faraday shield

A packaged integrated circuit (IC) includes a first substrate including a first plurality of layers and first circuit coupling features at an upper surface of the first substrate. The first plurality of layers include a first electromagnetic interference shielding layer. The packaged IC also includes a second substrate having an upper surface attached to a lower surface of the first substrate by an electrically conductive adhesive material. The second substrate includes a second plurality of layers and a second circuit coupling feature at a lower surface of the second substrate. The first plurality of layers includes a second EMI shielding layer. The packaged IC further includes a functional die disposed between the first and the second substrates and functionally coupled to the first and/or the second circuit coupling features. In the packaged IC, the adhesive material electrically couples the first and the second shielding layers.