Singulation method of semiconductor device

Provided is a singulation method of a semiconductor device that can perform a sawing process while protecting a pad. In the singulation method for forming a semiconductor device including a scribe lane region and a chip region, pads are formed in the chip region. Photoresist patterns exposing the scribe lane region and covering the pads are formed, and a substrate in the scribe lane region is cut and a washing solution is sprayed on the scribe lane region. According to the method, wafers can be stably separated from each other while pads of a semiconductor device are protected, so that stabilization in the fabrication process can be realized and pad corrosion caused by DI water is prevented during a sawing process. Accordingly, a defective device is minimized and reliability of a device can improve.