Integrated circuit package-on-package stacking system and method of manufacture thereof

Integrated circuit package-on-package stacking system and method of manufacture thereof

An integrated circuit package-on-package stacking method includes forming a leadframe interposer including: forming a leadframe having a lead; forming a molded base only supporting the lead; and singulating the leadframe interposer from the leadframe.

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Bibliographische Detailangaben
Hauptverfasser: Merilo, Dioscoro A, Kuan, Heap Hoe, Ong, You Yang, Chow, Seng Guan, Asoy, Ma. Shirley
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
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Beschreibung
Zusammenfassung:An integrated circuit package-on-package stacking method includes forming a leadframe interposer including: forming a leadframe having a lead; forming a molded base only supporting the lead; and singulating the leadframe interposer from the leadframe.