Capacitor interconnection

A substrate for power decoupling and a method of forming a substrate for power decoupling. The substrate comprises one or more decoupling capacitors; and one or more interconnections to the decoupling capacitors. At least one of the interconnections comprises a lossy material.

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Bibliographische Detailangaben
Hauptverfasser: Lu, Chee Wai Albert, Lok, Boon Keng, Wong, Chee Khuen Stephen, Chua, Kai Meng, Wai, Lai Lai, Vasudivan, Sunnappan
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
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Beschreibung
Zusammenfassung:A substrate for power decoupling and a method of forming a substrate for power decoupling. The substrate comprises one or more decoupling capacitors; and one or more interconnections to the decoupling capacitors. At least one of the interconnections comprises a lossy material.