Process for removing material from a substrate

A process for skiving a substrate is described, wherein the substrate is skived with a roller or a device or apparatus including the roller. The roller provides a cleaner skive than previously known methods without damage to underlying materials.

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Bibliographische Detailangaben
Hauptverfasser: Rankin, Jr, Charles M, Ricks, Theodore K, Weiner, Megan L, Macauley, John P, Coleman, Rusty J
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
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Beschreibung
Zusammenfassung:A process for skiving a substrate is described, wherein the substrate is skived with a roller or a device or apparatus including the roller. The roller provides a cleaner skive than previously known methods without damage to underlying materials.