Process for removing material from a substrate
A process for skiving a substrate is described, wherein the substrate is skived with a roller or a device or apparatus including the roller. The roller provides a cleaner skive than previously known methods without damage to underlying materials.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A process for skiving a substrate is described, wherein the substrate is skived with a roller or a device or apparatus including the roller. The roller provides a cleaner skive than previously known methods without damage to underlying materials. |
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