Optoelectronic integrated circuit device and communications equipment using same

A photoelectric integrated circuit device, in which photonic devices provided on the same substrate as the LSI are densely arranged along the four sides of the LSI, and characteristic degradation of the laser diode or photo detector due to heat generation can be prevented, furthermore optical wiring is easily performed on the board. A quadrilateral package substrate ; an LSI package mounted on the package substrate ; photonic devices mounted along two or more sides of the LSI package ; first photonic devices electrically connected to I/O terminals disposed on one side of the LSI package ; second photonic devices electrically connected to I/O terminals disposed on a different side of the LSI package ; first optical waveguides for connecting between the optical signal I/O terminals of the first photonic devices and an external component or device; and second optical waveguides for connecting between the optical I/O terminals of the second photonic devices and an external component or device; wherein the first and second optical waveguides are terminated on the same side edge of the package substrate