Printing of multi-layer circuits
The disclosure relates to circuits and methods for the manufacture of circuits, such as those which avoid the formation of undesirable short circuit paths. One such method maintains a layout area of a fluid composition receiving layer within a layout area of a dielectric layer. Another such method r...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The disclosure relates to circuits and methods for the manufacture of circuits, such as those which avoid the formation of undesirable short circuit paths. One such method maintains a layout area of a fluid composition receiving layer within a layout area of a dielectric layer. Another such method relates to the application of fluid composition receiving layers, conductive layers, and dielectric layers, such as in the provision of printed circuits. |
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