Defectivity and process control of electroless deposition in microelectronics applications

Defectivity and process control of electroless deposition in microelectronics applications

Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.

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Bibliographische Detailangaben
Hauptverfasser: Chen, Qingyun, Valverde, Charles, Paneccasio, Vincent, Petrov, Nicolai, Stritch, Daniel, Witt, Christian, Hurtubise, Richard
Format: Patent
Sprache:eng
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Zusammenfassung:Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.