Methods of spin-on wafer cleaning

Methods of spin-on wafer cleaning

A method for spin-on wafer cleaning. The method comprises controlling spin speed and vertical water jet pressure. The vertical jet pressure and the spin speed are substantially maintained in inverse proportion. Wafer spin speed is between 50 to 1200 rpm. Vertical wafer jet pressure is between 0.05 t...

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Hauptverfasser: Wu, Jun, Lu, Dong-Xuan, Lin, Shih-Chi, Lee, Wen-Long, Jian, Yi-An, Wang, Guang-Cheng, JangJian, Shiu-Ko, Ni, Chyi-Tsong, Wu, Szu-An, Wang, Ying-Lang
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creator Wu, Jun
Lu, Dong-Xuan
Lin, Shih-Chi
Lee, Wen-Long
Jian, Yi-An
Wang, Guang-Cheng
JangJian, Shiu-Ko
Ni, Chyi-Tsong
Wu, Szu-An
Wang, Ying-Lang
description A method for spin-on wafer cleaning. The method comprises controlling spin speed and vertical water jet pressure. The vertical jet pressure and the spin speed are substantially maintained in inverse proportion. Wafer spin speed is between 50 to 1200 rpm. Vertical wafer jet pressure is between 0.05 to 100 KPa.
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title Methods of spin-on wafer cleaning
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