Methods of spin-on wafer cleaning

Methods of spin-on wafer cleaning

A method for spin-on wafer cleaning. The method comprises controlling spin speed and vertical water jet pressure. The vertical jet pressure and the spin speed are substantially maintained in inverse proportion. Wafer spin speed is between 50 to 1200 rpm. Vertical wafer jet pressure is between 0.05 t...

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Bibliographische Detailangaben
Hauptverfasser: Wu, Jun, Lu, Dong-Xuan, Lin, Shih-Chi, Lee, Wen-Long, Jian, Yi-An, Wang, Guang-Cheng, JangJian, Shiu-Ko, Ni, Chyi-Tsong, Wu, Szu-An, Wang, Ying-Lang
Format: Patent
Sprache:eng
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Zusammenfassung:A method for spin-on wafer cleaning. The method comprises controlling spin speed and vertical water jet pressure. The vertical jet pressure and the spin speed are substantially maintained in inverse proportion. Wafer spin speed is between 50 to 1200 rpm. Vertical wafer jet pressure is between 0.05 to 100 KPa.