Semiconductor device and method for manufacturing the same

The present invention discloses improved semiconductor device and method for manufacturing wherein one side of a source and drain region and a portion of a channel region are disposed on a buried oxide layer formed on a semiconductor substrate and the side of the source and drain region and another...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Lee, Sang Don, Kim, Yil Wook, Ahn, Jin Hong
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention discloses improved semiconductor device and method for manufacturing wherein one side of a source and drain region and a portion of a channel region are disposed on a buried oxide layer formed on a semiconductor substrate and the side of the source and drain region and another portion of the channel region are disposed on a Si epitaxial layer formed on a semiconductor substrate.