Printed circuit boards for high-speed communication

Apparatus and method for communicating high-speed signals between a primary printed circuit board and one or more secondary printed circuit boards. The high-speed signals are communicated between the primary printed circuit boards and the secondary printed circuit boards through multi-layer flexible...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Phan, Chinh Q, Lombaerde, Robert P, Shah, Jignesh H
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
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Beschreibung
Zusammenfassung:Apparatus and method for communicating high-speed signals between a primary printed circuit board and one or more secondary printed circuit boards. The high-speed signals are communicated between the primary printed circuit boards and the secondary printed circuit boards through multi-layer flexible conductors.