Wiring board with a protective film greater in heights than bumps

a a A wiring board according to the present invention includes: an insulating base ; a plurality of first conductor wirings aligned in an inner region on the insulating base; bumps formed on the respective first conductor wirings; and a protective film that is formed on the insulating base so as to cover the first conductor wirings and has an opening region through which the bumps are exposed. The height of at least part of a surface of the protective film from a surface of the insulating base is greater than the height of the bumps from the surface of the insulating base. With this configuration, it is possible to decrease the thickness in the state where a protective tape is placed on the wiring board to protect bumps, thereby increasing the length of the wiring board that can be held by a reel for supplying the wiring board.