Ceramic electronic component and method for manufacturing the same
In a ceramic electronic component, an electrically conductive resin layer is arranged to cover a thick film layer and to extend beyond the end of the thick film layer by at least about 100 μm and a plating layer is arranged to cover the electrically conductive resin layer except a region having a di...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | In a ceramic electronic component, an electrically conductive resin layer is arranged to cover a thick film layer and to extend beyond the end of the thick film layer by at least about 100 μm and a plating layer is arranged to cover the electrically conductive resin layer except a region having a dimension of at least about 50 μm and extending along the end of the electrically conductive resin layer. Consequently, the concentration of the stress is reduced. |
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